Chap 31 Resin Bonded Prostheses

 
Advantages
1. minimal tooth reduction
2. convertibility
3. no anesthesia
4. reduced cost
 
Disadvantages
1. possible debonding
2. anterior esthetic concern
3. equipment required
4. no trial period
 
Indications
1. sound teeth with large pulp chamber
2. Ä¡ÁúÀÇ »èÁ¦¸¦ ÃÖ¼Ò·Î Çϱ⸦ ¿øÇÒ ¶§
3. interim bridge
4. periodontal splinting
5. post orthodontic retention
 
Contraindication
1. unesthetic abutments(alignment, space)
2. insufficient sound enamel
3. long spans(ÃÖ´ë 4 unit)
4. heavy occlusal force
 
Principles of retainer design
1. a distinct path of insertion must be created in an occlusogigival
direction(minimal taper)
2. proximal resistance form; groove and wrap-around(1800)
3. prep within enamel
4. maximum coverage
5. vertical rest is required
6. shallow chamfer margins(supragingival 0.5-1mm)
7. rigid framework

 
Abutment preparation procedure
medium, coarse diamond point¸¦ »ç¿ë
1. occlusal prep. and rest seat
ÇÏ¾Ç ÀüÄ¡¸¦ Àç¿ÜÇϰí´Â 0.5mmÀÇ occ clearance°¡ ÇÊ¿äÇÏ´Ù. ´ëÇÕÄ¡¿ÍÀÇ ±³ÇÕ¿¡ ¹æÇصÇÁö ¾Ê°í ½É¹ÌÀû Àå¾Ö ¾øÀ¸¸é °¡´ÉÇÑ ³Ð°Ô ±Ý¼ÓÀ¸·Î Çǰ³
±¸Ä¡ºÎ´Â # 6 ÀÇ round bur·Î ±³ÇÕ¸éÀÇ ±Ù,¿ø½É¸é¿¡ 1-1.5mm±íÀÌ·Î Çü¼º
ÀüÄ¡ºÎ´Â # 35 inverted cone bur·Î ±Ù,¿ø½É marginal ridge±îÁö cingulum notch Çü¼º
2. lingual and prox. reduction
Áø´Ü¸ðÇü¿¡¼­surveyÇÏ¿© path of insertionÀ» °áÁ¤Çϰí minimal taper·Î prep.
½É¹ÌÀûÀÎ ¹®Á¦°¡ ¾ø´Â °÷Àº 180µµ ÀÌ»ó wrap-around, ÀüÄ¡ºÎ¿¡¼­´Â ½É¹Ì¼ºÀ» Áß½ÃÇϰí groove·Î resistance formÇü¼º.
ÀÎÁ¢Ä¡¾Æ ÀÖ´Â °æ¿ì´Â finishing lineÀÌ contact point¿¡ ±ÙÁ¢Çϳª ħ¹üÇÏÁö´Â ¾Ê´Â´Ù.
3. finish line
enamel »ó¿¡¼­ »èÁ¦°¡ ³¡³ª¸é¼­ shallow chamferÀÇ cervical marginÀ» supragingival 0.5-1mm¿¡ À§Ä¡ÇÏ°Ô ÇÔ.
4. groove
#169 bur·Î Ä¡¾Æ Áß½ÉÀ» ±âÁØÀ¸·Î 180µµ ÀÌ»ó ¶³¾îÁø °÷¿¡ ÆòÇàµÇ°Ô ¼³Ä¡ÇÑ´Ù.
À¯Áö·Â ÁõÁøÀ» À§ÇÑ ºÎ°¡Àû groove¸¦ ¼³Ãø ±³µÎ ±Ùó¿¡ Çü¼ºÇÒ ¼ö ÀÖ´Ù.
 
Impression & temporarization
º¸ÅëÀº gingival retractionÀº ÇÊ¿äÇÏÁö ¾Ê°í rubber base impression, agar impression material·Î Àλó 䵿
µ¿¿ä°¡ ÀÖ´Â Ä¡¾Æ´Â labio-proximalÃøÀ» etchingÈÄ resin bonding½ÃÄÑ °íÁ¤ÇÑ ÈÄ Àλó 䵿ÇÑ´Ù.(periodontal splint)
stoneÀ¸·Î cast¸¦ º×°í °¢ Áö´ëÄ¡¸¶´Ù º°°³·Î die¸¦ ¸¸µéÁö ¾Ê´Â´Ù.
±â°ø»ç¸¦ À§ÇØ design°ú marginÀ» Ç¥½ÃÇØ ÁØ´Ù.
temporaizationÀº occlusal holding cuspÀÌ »èÁ¦µÈ °æ¿ì¸¸ ´ëÇÕÄ¡¿¡ acid etchingÇϰí bonding agent µµÆ÷¾øÀÌ º¹ÇÕ·¹ÁøÀÇ ÁöÁöÁ¡À» ºÎ¿©ÇÏ¿© supereruptionÀ» ¹æÁöÇÑ´Ù.

Retention of metal surface
1. macroscopic retention
perforate- Rochette design(1972)
mesh- polyester, nylon
pit and bead-water soluble salt, Virginia bridge(1985)
2. microscopic retention
sandblasting
electrochemical etching - Maryland bridge(1981)
chemical etching
3. chemical retention
tin plating
oxidize
silicoating
 
Etching and bonding of etched cast restoration
1. electrolytic etching of bond metal surface
1) wax up, casting, finishingÈÄ ultrasonic cleaningÇÑ´Ù
2) etching unitÀÇ ¾ç±Ø¿¡ multiple contactµÇ°Ô ÇÑ´Ù.
3) sticky wax·Î °íÁ¤ÇÑ ´ÙÀ½ Àü·ù¸¦ Àß Åë°úÇÏ´ÂÁö È®ÀÎÇÑ´Ù.
4) etching ½ÃŰÁö ¾ÊÀ» ºÎÀ§µµ wax·Î Çǰ³ÇÑ´Ù.
5) etching½Ãų ºÎÀ§¸¦ 50¥ì alumina·Î sand blastingÇÑ´Ù
6) etching½Ãų ºÎÀ§ÀÇ ¸éÀû¿¡ µû¸¥ Àü·ùÀÇ ¾çÀ» °è»êÇÑ´Ù.
7) ÀüÇØ¾×(Ni-Cr-Be;Ȳ»ê, Ni-Cr-Co;Áú»ê)¼Ó¿¡¼­ electrode°¡ 1.5-2cm ¶³¾îÁ®¼­ ¸¶ÁÖº¸°Ô À§Ä¡½ÃŲ´Ù.
8) Á¶°Ç¿¡ ¸Â´Â etching timeµ¿¾È etchingÇÑ´Ù.
9) cleaning, checkingÇÑ ÈÄ electrode¸¦ ºÐ¸®ÇÑ´Ù
2. acid etching of enamel surface
1) cleaning abutment tooth with pumice
2) dry the field
3) etching solution; 30-50 % phosphoric acid for a minute
4) washing and dry
5) bonding agent(unfilled resin) apply
- most adhesive resin cement claims for strong adhesion to all tooth surfaces and alloys
- oral environment; wet, changes of temperature, polymerization shrinkage
- adhesion of resin cement = reduction of microleakage
- if dentinal sealing is obtained, pulpal pathology will not follow
- adhesion; chemical(ionic to mineralized, covalent to organic)
micromechanical(tubular penetration)
3. bonding with resin cement
[1] 4-META°è resin cement(Super-Bond C&B)
1) ¼ºÁú
(1) 4- Metacryloxy Ethyl Trimelliate Anhydride¸¦ ÇÔÀ¯ÇÏ´Â unfilled resin
(2) »ó¾ÆÁú,¹ý¶ûÁú,¸ðµç ±Ý¼Ó,·¹Áø µî°ú °­ÇÑ È­ÇÐÀû Á¢Âø·ÂÀ» °®´Â´Ù(200-300 Kg/cm2)
(3) ÀÚ°¡ ÁßÇÕ ¹ÝÀÀ
(4) ±¸°­³» Ÿ¾×¿¡ ¿ëÇØµÇÁö ¾Ê¾Æ ¹Ì¼¼´©ÃâÀÌ ¾ø´Ù
2) »ç¿ë¹ý
(1) Ä¡¸é ¼¼¸¶ ¹× °ÇÁ¶
(2) ¹ý¶ûÁú,»ó¾ÆÁú acid etchingÈÄ ¼¼Ã´ °ÇÁ¶
(3) active liquid ÁØ(monomer 4 drop + catalyst 1 drop) - 5ºÐ ³»¿¡ »ç¿ë
(4) active liquid¸¦ Á¢Âø¸é¿¡ º×À¸·Î µµÆ÷
(5) ³²Àº active liquid¿¡ powder 1 spoonÀ» ³Ö°í È¥ÇÕ
(6) liquid - powder¸¦ º¸Ã¶¹° ³»¸é¿¡ ¹Ù¸£°í Á¢ÇÕÇÑ ÈÄ 3ºÐÀÌ °æ°úÇÏ¸é ¿©ºÐÀÇ ½Ã¸àÆ®¸¦ explore·Î Á¦°ÅÇÑ´Ù
(7) Á¢ÂøÈÄ 10ºÐÀÌ °æ°úÇÏ¸é °æÈ­°¡ ¿Ï·áµÊ
(8) °æÈ­ÈÄ Á¶ÀýÀº finishing bur »ç¿ë
3) ±Ý¼Ó Ç¥¸é ó¸®
-±Í±Ý¼Ó-
sandblast -> heating(400µµ, 5-10ºÐ)
sandblast -> 3% H2SO4 + 1% potassium permanganate
(yellow G.; 30ÃÊ, white G.; 30ºÐ)
-Ni Cr alloy-
sandblast ->3% H2SO4 + 1% potassium permanganate(5-10ÃÊ)
sandblast -> "EZ-Oxizer"»ç¿ë
-Co Cr alloy-
sandblast·Î ÃæºÐ
[2] Àλê ester°è Bis-GMA resin cement(Panavia, ABC Cement)
1)¼ºÁú
(1) active phosphate ester¸¦ ÇÔÀ¯ÇÏ´Â Bis-GMA°èÀÇ ¹Ì¼¼ º¹ÇÕ ·¹Áø
(2) °­ÇÑ È­ÇÐÀû Á¢Âø·Â(100-400 Kg/cm2)
(3) °ø±â¿Í Á¢Ã˵ÇÁö ¾ÊÀ» ¶§ ÀÚ°¡ ÁßÇÕ
(4) radiopacity
(5) ±â°èÀû °­µµ°¡ Å©´Ù(¾ÐÃà°­µµ ZPCÀÇ 2.5¹è)
2)»ç¿ë¹ý
(1) Ä¡¸é ¼¼¸¶ ¹× °ÇÁ¶
(2) ¹ý¶ûÁú,»ó¾ÆÁú acid etchingÈÄ ¼¼Ã´ °ÇÁ¶
(3) ºñ±Í±Ý¼ÓÀº sandblasting ±Í±Ý¼ÓÀº sandblast -> tin-plating, EX-oxizer
(4) ºÐ¸»À» Àß ¼¯Àº ÈÄ mixing padÀ§¿¡ 1 spoon ¾ñ°í liquid 1 drop
(5) 60-90 Ãʰ£ ³Ð°Ô È¥ÇÕ
(6) º¸Ã¶¹° ³»¸é¿¡ ¹Ù¸£°í Á¢ÇÕÇÑ ÈÄ Áï½Ã¿©ºÐÀÇ ½Ã¸àÆ®¸¦ º×À¸·Î Á¦°ÅÇϰí margin¿¡ grease µµÆ÷ÇÑ´Ù
(7) Á¢ÂøÈÄ 6ºÐ ³»¿¡ °æÈ­°¡ ¿Ï·áµÊ
[3] dimetarcrylte°è resin cement(Comspan, Ultrabond))
(1) Bis-GMA³ª urethane dimetacrylateÀ» ·¹Áø ±âÁú·Î Çϰí fillerÀÇ ÇÔÀ¯·®ÀÌ Å« º¹ÇÕ·¹ÁøÀ¸·Î viscosity°¡ ³ôÀ½.
(2) chemical bonding ¾ø´Â º¸Á¸ ¿µ¿ªÀÇ º¹ÇÕ·¹Áø°ú À¯»çÇÔ