- Chap 31 Resin Bonded Prostheses
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- Advantages
- 1. minimal tooth reduction
- 2. convertibility
- 3. no anesthesia
- 4. reduced cost
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- Disadvantages
- 1. possible debonding
- 2. anterior esthetic concern
- 3. equipment required
- 4. no trial period
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- Indications
- 1. sound teeth with large pulp chamber
- 2. Ä¡ÁúÀÇ »èÁ¦¸¦ ÃÖ¼Ò·Î Çϱ⸦ ¿øÇÒ ¶§
- 3. interim bridge
- 4. periodontal splinting
- 5. post orthodontic retention
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- Contraindication
- 1. unesthetic abutments(alignment, space)
- 2. insufficient sound enamel
- 3. long spans(ÃÖ´ë 4 unit)
- 4. heavy occlusal force
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- Principles of retainer design
- 1. a distinct path of insertion must be created in an occlusogigival
- direction(minimal taper)
- 2. proximal resistance form; groove and wrap-around(1800)
- 3. prep within enamel
- 4. maximum coverage
- 5. vertical rest is required
- 6. shallow chamfer margins(supragingival 0.5-1mm)
- 7. rigid framework
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- Abutment preparation procedure
- medium, coarse diamond point¸¦ »ç¿ë
- 1. occlusal prep. and rest seat
- ÇÏ¾Ç ÀüÄ¡¸¦ Àç¿ÜÇϰí´Â 0.5mmÀÇ occ clearance°¡ ÇÊ¿äÇÏ´Ù. ´ëÇÕÄ¡¿ÍÀÇ
±³ÇÕ¿¡ ¹æÇصÇÁö ¾Ê°í ½É¹ÌÀû Àå¾Ö ¾øÀ¸¸é °¡´ÉÇÑ ³Ð°Ô ±Ý¼ÓÀ¸·Î Çǰ³
- ±¸Ä¡ºÎ´Â # 6 ÀÇ round bur·Î ±³ÇÕ¸éÀÇ ±Ù,¿ø½É¸é¿¡ 1-1.5mm±íÀÌ·Î Çü¼º
- ÀüÄ¡ºÎ´Â # 35 inverted cone bur·Î ±Ù,¿ø½É marginal ridge±îÁö cingulum
notch Çü¼º
- 2. lingual and prox. reduction
- Áø´Ü¸ðÇü¿¡¼surveyÇÏ¿© path of insertionÀ» °áÁ¤Çϰí minimal taper·Î
prep.
- ½É¹ÌÀûÀÎ ¹®Á¦°¡ ¾ø´Â °÷Àº 180µµ ÀÌ»ó wrap-around, ÀüÄ¡ºÎ¿¡¼´Â ½É¹Ì¼ºÀ»
Áß½ÃÇϰí groove·Î resistance formÇü¼º.
- ÀÎÁ¢Ä¡¾Æ ÀÖ´Â °æ¿ì´Â finishing lineÀÌ contact point¿¡ ±ÙÁ¢Çϳª ħ¹üÇÏÁö´Â
¾Ê´Â´Ù.
- 3. finish line
- enamel »ó¿¡¼ »èÁ¦°¡ ³¡³ª¸é¼ shallow chamferÀÇ cervical marginÀ»
supragingival 0.5-1mm¿¡ À§Ä¡ÇÏ°Ô ÇÔ.
- 4. groove
- #169 bur·Î Ä¡¾Æ Áß½ÉÀ» ±âÁØÀ¸·Î 180µµ ÀÌ»ó ¶³¾îÁø °÷¿¡ ÆòÇàµÇ°Ô ¼³Ä¡ÇÑ´Ù.
- À¯Áö·Â ÁõÁøÀ» À§ÇÑ ºÎ°¡Àû groove¸¦ ¼³Ãø ±³µÎ ±Ùó¿¡ Çü¼ºÇÒ ¼ö ÀÖ´Ù.
-
- Impression & temporarization
- º¸ÅëÀº gingival retractionÀº ÇÊ¿äÇÏÁö ¾Ê°í rubber base impression,
agar impression material·Î Àλó 䵿
- µ¿¿ä°¡ ÀÖ´Â Ä¡¾Æ´Â labio-proximalÃøÀ» etchingÈÄ resin bonding½ÃÄÑ
°íÁ¤ÇÑ ÈÄ Àλó 䵿ÇÑ´Ù.(periodontal splint)
- stoneÀ¸·Î cast¸¦ º×°í °¢ Áö´ëÄ¡¸¶´Ù º°°³·Î die¸¦ ¸¸µéÁö ¾Ê´Â´Ù.
- ±â°ø»ç¸¦ À§ÇØ design°ú marginÀ» Ç¥½ÃÇØ ÁØ´Ù.
- temporaizationÀº occlusal holding cuspÀÌ »èÁ¦µÈ °æ¿ì¸¸ ´ëÇÕÄ¡¿¡ acid
etchingÇϰí bonding agent µµÆ÷¾øÀÌ º¹ÇÕ·¹ÁøÀÇ ÁöÁöÁ¡À» ºÎ¿©ÇÏ¿© supereruptionÀ»
¹æÁöÇÑ´Ù.
- Retention of metal surface
- 1. macroscopic retention
- perforate- Rochette design(1972)
- mesh- polyester, nylon
- pit and bead-water soluble salt, Virginia bridge(1985)
- 2. microscopic retention
- sandblasting
- electrochemical etching - Maryland bridge(1981)
- chemical etching
- 3. chemical retention
- tin plating
- oxidize
- silicoating
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- Etching and bonding of etched cast restoration
- 1. electrolytic etching of bond metal surface
- 1) wax up, casting, finishingÈÄ ultrasonic cleaningÇÑ´Ù
- 2) etching unitÀÇ ¾ç±Ø¿¡ multiple contactµÇ°Ô ÇÑ´Ù.
- 3) sticky wax·Î °íÁ¤ÇÑ ´ÙÀ½ Àü·ù¸¦ Àß Åë°úÇÏ´ÂÁö È®ÀÎÇÑ´Ù.
- 4) etching ½ÃŰÁö ¾ÊÀ» ºÎÀ§µµ wax·Î Çǰ³ÇÑ´Ù.
- 5) etching½Ãų ºÎÀ§¸¦ 50¥ì alumina·Î sand blastingÇÑ´Ù
- 6) etching½Ãų ºÎÀ§ÀÇ ¸éÀû¿¡ µû¸¥ Àü·ùÀÇ ¾çÀ» °è»êÇÑ´Ù.
- 7) ÀüÇØ¾×(Ni-Cr-Be;Ȳ»ê, Ni-Cr-Co;Áú»ê)¼Ó¿¡¼ electrode°¡ 1.5-2cm
¶³¾îÁ®¼ ¸¶ÁÖº¸°Ô À§Ä¡½ÃŲ´Ù.
- 8) Á¶°Ç¿¡ ¸Â´Â etching timeµ¿¾È etchingÇÑ´Ù.
- 9) cleaning, checkingÇÑ ÈÄ electrode¸¦ ºÐ¸®ÇÑ´Ù
- 2. acid etching of enamel surface
- 1) cleaning abutment tooth with pumice
- 2) dry the field
- 3) etching solution; 30-50 % phosphoric acid for a minute
- 4) washing and dry
- 5) bonding agent(unfilled resin) apply
- - most adhesive resin cement claims for strong adhesion to all tooth
surfaces and alloys
- - oral environment; wet, changes of temperature, polymerization shrinkage
- - adhesion of resin cement = reduction of microleakage
- - if dentinal sealing is obtained, pulpal pathology will not follow
- - adhesion; chemical(ionic to mineralized, covalent to organic)
- micromechanical(tubular penetration)
- 3. bonding with resin cement
- [1] 4-META°è resin cement(Super-Bond C&B)
- 1) ¼ºÁú
- (1) 4- Metacryloxy Ethyl Trimelliate Anhydride¸¦ ÇÔÀ¯ÇÏ´Â unfilled
resin
- (2) »ó¾ÆÁú,¹ý¶ûÁú,¸ðµç ±Ý¼Ó,·¹Áø µî°ú °ÇÑ ÈÇÐÀû Á¢Âø·ÂÀ» °®´Â´Ù(200-300
Kg/cm2)
- (3) ÀÚ°¡ ÁßÇÕ ¹ÝÀÀ
- (4) ±¸°³» Ÿ¾×¿¡ ¿ëÇØµÇÁö ¾Ê¾Æ ¹Ì¼¼´©ÃâÀÌ ¾ø´Ù
- 2) »ç¿ë¹ý
- (1) Ä¡¸é ¼¼¸¶ ¹× °ÇÁ¶
- (2) ¹ý¶ûÁú,»ó¾ÆÁú acid etchingÈÄ ¼¼Ã´ °ÇÁ¶
- (3) active liquid ÁØ(monomer 4 drop + catalyst 1 drop) - 5ºÐ ³»¿¡
»ç¿ë
- (4) active liquid¸¦ Á¢Âø¸é¿¡ º×À¸·Î µµÆ÷
- (5) ³²Àº active liquid¿¡ powder 1 spoonÀ» ³Ö°í È¥ÇÕ
- (6) liquid - powder¸¦ º¸Ã¶¹° ³»¸é¿¡ ¹Ù¸£°í Á¢ÇÕÇÑ ÈÄ 3ºÐÀÌ °æ°úÇϸé
¿©ºÐÀÇ ½Ã¸àÆ®¸¦ explore·Î Á¦°ÅÇÑ´Ù
- (7) Á¢ÂøÈÄ 10ºÐÀÌ °æ°úÇÏ¸é °æÈ°¡ ¿Ï·áµÊ
- (8) °æÈÈÄ Á¶ÀýÀº finishing bur »ç¿ë
- 3) ±Ý¼Ó Ç¥¸é ó¸®
- -±Í±Ý¼Ó-
- sandblast -> heating(400µµ, 5-10ºÐ)
- sandblast -> 3% H2SO4 + 1% potassium
permanganate
- (yellow G.; 30ÃÊ, white G.; 30ºÐ)
- -Ni Cr alloy-
- sandblast ->3% H2SO4 + 1% potassium permanganate(5-10ÃÊ)
- sandblast -> "EZ-Oxizer"»ç¿ë
- -Co Cr alloy-
- sandblast·Î ÃæºÐ
- [2] Àλê ester°è Bis-GMA resin cement(Panavia, ABC Cement)
- 1)¼ºÁú
- (1) active phosphate ester¸¦ ÇÔÀ¯ÇÏ´Â Bis-GMA°èÀÇ ¹Ì¼¼ º¹ÇÕ ·¹Áø
- (2) °ÇÑ ÈÇÐÀû Á¢Âø·Â(100-400 Kg/cm2)
- (3) °ø±â¿Í Á¢Ã˵ÇÁö ¾ÊÀ» ¶§ ÀÚ°¡ ÁßÇÕ
- (4) radiopacity
- (5) ±â°èÀû °µµ°¡ Å©´Ù(¾ÐÃà°µµ ZPCÀÇ 2.5¹è)
- 2)»ç¿ë¹ý
- (1) Ä¡¸é ¼¼¸¶ ¹× °ÇÁ¶
- (2) ¹ý¶ûÁú,»ó¾ÆÁú acid etchingÈÄ ¼¼Ã´ °ÇÁ¶
- (3) ºñ±Í±Ý¼ÓÀº sandblasting ±Í±Ý¼ÓÀº sandblast -> tin-plating,
EX-oxizer
- (4) ºÐ¸»À» Àß ¼¯Àº ÈÄ mixing padÀ§¿¡ 1 spoon ¾ñ°í liquid 1 drop
- (5) 60-90 Ãʰ£ ³Ð°Ô È¥ÇÕ
- (6) º¸Ã¶¹° ³»¸é¿¡ ¹Ù¸£°í Á¢ÇÕÇÑ ÈÄ Áï½Ã¿©ºÐÀÇ ½Ã¸àÆ®¸¦ º×À¸·Î Á¦°ÅÇϰí
margin¿¡ grease µµÆ÷ÇÑ´Ù
- (7) Á¢ÂøÈÄ 6ºÐ ³»¿¡ °æÈ°¡ ¿Ï·áµÊ
- [3] dimetarcrylte°è resin cement(Comspan, Ultrabond))
- (1) Bis-GMA³ª urethane dimetacrylateÀ» ·¹Áø ±âÁú·Î Çϰí fillerÀÇ ÇÔÀ¯·®ÀÌ
Å« º¹ÇÕ·¹ÁøÀ¸·Î viscosity°¡ ³ôÀ½.
- (2) chemical bonding ¾ø´Â º¸Á¸ ¿µ¿ªÀÇ º¹ÇÕ·¹Áø°ú À¯»çÇÔ
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