Conference Proceedings

1. T. Asahina*, I. Jeon, K. Katou, T. Sonoda, “Nondestructive structural analysis on deformation properties of highly porous aluminum material,” Advanced Nondestructive Evaluation 2005, Jeju, Korea, Nov. 9, 2005. Also accepted to Key Engineering Materials, 2006.

2. I. Jeon*, M. Omiya, H. Inoue, K. Kishimoto and T. Asahina, “A new specimen for measuring the interfacial toughness of Al-0.5%Cu thin film on Si substrate,” Asian Pacific Conference on Fracture and Strength 04, Jeju, Korea, Oct. 6, 2004. Also published in Key Engineering Materials, Vol. 297-300, pp. 521-526, 2005.

3. I. Jeon*, Y.B. Park, H. Inoue and K. Kishimoto, “Thermo-mechanical stress in passivated Al-0.5%Cu thin films,” The 5th International Conference on Fracture and Strength of Solids, Sendai, Japan, Oct. 21, 2003. Also published in Key Engineering Materials, Vol. 261-263, pp. 507-512, 2004.

4. Insu Jeon*, Qwanho Chung, Joonki Hong, and Kwangyoo Byun, “The effect of ultrasonic power on bonding pads and IMD layers in ultrasonic wire bonding,” The 3rd International Symposium on Electronic Materials and Packagings 2001, Nov. 19-22, Jeju, Korea, pp. 235-242, 2001.

5. S. Im* and I. Jeon, “Higher order singularities in elastic-plastic fracture,” PLASTICITY'00, The Eighth Int. Symposium on Plasticity and its Current Applications, Whistler, Canada, pp. 407-409, 2000.

6. I. Jeon and S. Im*, “Energetics of the higher order singularities in elastic-plastic crack tips,” ICES '98, Modeling and Simulation Based Engineering, Atlanta, USA, pp. 1281-1286, 1998.

7. S. Im* and I. Jeon, “Application of two-state M-integral to a triple junction vertex under thermal loading,” ASME Int. Mech. Engr. Congress and Exposition PVP – Vol. 342/MD – Vol. 72, Recent Advances in Solids/Structure and Application of Metallic Materials, 1996.

8. S. Im and I. Jeon*, “Analysis for delamination crack in a laminated composite strip under generalized plane deformation,” Third Internal Conf. on Computational Engineering, July 21-26, New Orleans, USA, pp. 403-404, 1996.

9. S. Im* and I. Jeon, “Computation of stress intensities for edge delamination in a laminated composite strip,” Eringen Medal Symposium in 32nd Annual Meeting of Society of Engineering Science, pp. 179-190, 1995.

*: Presenting Author

Presentations

Invited Presentations

1. Insu Jeon, “The effect of structural defects on the deformation behavior of closed-cell Al foam,” Department of Mechanical Engineering, KAIST, Korea, Nov. 2, 2004.

2. Insu Jeon, “Failure analysis for electronic devices,” Department of Mechanical Engineering, Meiji University, Japan, Jan. 9, 2004.

3. Insu Jeon, “Efficient analysis technique for the warpage problem in TSOP,” R&D Center, KCC Corporation, Korea, Jan. 10, 2003.

Conference Presentations

1. I. Jeon*, K. Katou, T. Sonoda, T. Asahina, “Deformation analysis of closed-cell Al foam using X-ray CT system and FEM,” Advanced Nondestructive Evaluation 2005, Jeju, Korea, Nov. 9, 2005.

2. I. Jeon*, Y. Yamada, K. Yamada, K. Katou, T. Sonoda, T. Asahina, “Comparison of two numerical analysis methods for the deformation behavior of closed-cell Al foam,” MetFoam2005, Kyoto, Japan, Sep. 25, 2005.

3. T. Asahina*, I. Jeon, K. Katou, T. Sonoda, Y. Yamada, “Structural and dynamical evaluation of highly porous Aluminum material prepared by space-holder method,” MetFoam2005, Kyoto, Japan, Sep. 25, 2005.

4. I. Jeon*, K. Yamada, K. Katou, T. Asahina, “The numerical study on the compressive behavior of closed-cell Al foam,” McMAT2005, Louisiana, USA, June 6, 2005.

5. I. Jeon, Y. Yamada, K. Yamada, K. Katou, T. Sonoda, T. Asahina*, “The effect of structural defects on the compressive behavior of closed-cell Al foam,” CellMet2005, Dresden, Germany, May 19, 2005.

6. T. Asahina*, I. Jeon, K. Katou, T. Sonoda, Y. Yamada, “Structural and dynamical evaluation of highly porous Aluminum material prepared by space-holder method,“ CellMet2005, Dresden, Germany, May 19, 2005.

*: Presenting Author